More than 90 participants joined Bosch Packaging Technology’s customer symposium, on 18th of March, kicking-off the first day of CPHI Japan, in Tokyo.
While during the day several technology experts presented on current developments, which meet Japan’s high requirements in the pharmaceutical industry, the evening left many opportunities for discussion and exchange.
Mr. Norikazu Eiki (former chairman at Bayer Yakuhin, Ltd.) opened the event talking about the latest global pharmaceutical trends and further gave an outlook on the pipeline of upcoming biosimilar products and occurring challenges for manufacturing, packaging and inspection processes.
Many presentations focused on high-end containment solutions for liquid and solid processing and packaging, as it is required in the Japanese pharmaceutical industry. Furthermore, speakers illustrated technical and commercial benefits of continuous solid manufacturing and showed best practices of up-to-date GAMP5 principles. Jörg Stadelmann, Wim van der Goten, Matthias Angelmaier and Dr. Berthold Düthorn, from Bosch Packaging Technology, gave the audience a very good understanding of state-of-the-art manufacturing processes and the respective technologies available, on a global scale.
Overall, the feedback received was very positive and confirms the market leading position of Bosch Packaging Technology.
“For us, the Japanese market is a global benchmark for excellence in pharmaceutical manufacturing. We are very proud of a widespread local network of customers and partners, which enable us to pursue our goal of sustaining a thought leadership position in processing and packaging technology.” Andreas Gross, product manager inspection technologies at Bosch Packaging Technology, summarizes the event.
Some voices collected from participants throughout the day:
– “I especially enjoyed the open atmosphere and the interesting pharma trends presented.”
– “We work with Bosch equipment since many years and feel very well informed on new technologies.”
– “As we consult pharma companies in setting up manufacturing equipment, we are impressed by the manifold containment options available in liquid and solid processing.”
Bernd Barkey, general manager at Bosch Packaging Technology in Japan, concluded:
“We would like to thank our valued customers and partners who made this event a great success. For the future, we plan to organize similar events.”
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