Bosch Packaging Technology is exhibiting at this year’s Interphex in Tokyo, Japan. Visit us from 3rd to 5th of July on booth W3-72 in West hall.
For the first time, we will present a module of the ALF 5000 filling and closing machine for vials and ampoules with a Virtual Reality (VR) application for training purposes. In addition, we will present Inspection Technology solutions showing benchtop for vacuum decay detection, KLV 1011 as well as our new initiative to introduce deep learning and Artificial Intelligence (AI).
For producing solid pharmaceuticals, we will have the capsule filling machine GFK 702 ProTect on the booth: a variable containment machine for small batches with optimized access to the production area and a small footprint. Also the Xelum R&D for the continuous production of oral solid dosage (OSD) forms stops its world tour at Interphex.
Take the opportunity to talk to our experts about our latest processing technology and packaging solutions, as well after sales service that can boost your production with modernization, spare parts and field service.
We look forward to welcoming you in Tokyo.
Phone: +49 7951 402-648