At PACK EXPO International 2014, Bosch will show several technologies from its broad secondary packaging portfolio.
Sigpack TTMC case packer: maximum flexibility and OEE
Presented to North American manufacturers for the first time, the Sigpack TTMC case packer is designed to handle a variety of pre-packed food, non-food and pharmaceutical applications. The highly compact machine with its ergonomic design can be adjusted quickly without tools to the required format and product configuration with vertical start-up. Products can be supplied flat or on edge and packaged into Regular Slotted Container (RSC), Half Slotted Container (HSC), with retail-ready functionality. Multiple case closing options are available, ranging from a tape or hot melt solution to the release of unsealed cases for third-party closure. The case packer will be on display as part of the Seamless Systems cracker packaging line.
Elematic 3001: ease of use meets increased uptime
For the first time in North America, Bosch will showcase its highly flexible Elematic 3001 wrap-around case packer. Developed for increased uptime and ease of use, the machine’s new ergonomic design features a low blank magazine height, an optimized hot melt system as well as the Elematic Click system for quick, tool-less and reproducible format changeovers. When parts lock into place, operators are notified with a click sound and aligned color-coded components, letting them hear and see that the format changeover is complete, supporting to increase uptime. The case packer runs multiple retail-ready pack styles including tray, classic full wrap-around, ledge tray as well as tray with hood.
CCM 3100: versatile case packing of bags and flow-wrapped packages
Bosch will also present its CCM 3100 case packer which is capable of packing bags in both stand-up or lay-flat orientation. Designed for shorter production runs and more frequent changes in product packaging styles, this case packer features a wide format range in both bag and case sizes and styles. The CCM 3100 easily integrates with vertical form, fill and seal (VFFS), as well as horizontal form, fill and seal (HFFS) machines. Products can be handled individually or in groups, and are picked and placed by a two-axis robot with vacuum or gripper end-effectors at up to 180 ppm. Additionally, its open frame enables easy access for quick changeovers.
Food and pharmaceutical manufacturers can learn more about Bosch’s latest secondary packaging solutions in the South Hall, booth S-3514 at PACK EXPO International in Chicago, Illinois, United States, November 2 to 5. Additional pharmaceutical solutions from Bosch can be seen at Pharma Expo, co-located with PACK EXPO, in the West Hall, booth W-603.
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