Archive for January, 2012




Innovative ultrasonic cutting technology from Bosch

ultrasonic cutting technology

The new ultrasonic cross cutting system is developed for products difficult to cut. The product strands are cross cutted into individual bars using ultrasonic technology. The new technology exposes the products to minimal stress and pressure, reducing product quality affection to a minimum. Due to the fast micro oscillation clear and sharp edges as well as plain surfaces are achieved. This further enhances the product quality. The system is particularly developed for difficult cutting applications of sensitive, sticky, laminated or layered products. …more


Secondary packaging for a wide range of formats

Secondary packaging

Confectionery companies are trying to attract consumers with new flavours, sizes and pack styles of their products. This is why they use packaging systems that allow quick and easy format changes as for example the Sigpack TTM, which is part of the new generation of integrated toploaders for secondary packaging. …more







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